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5 March 2021 An integrated near-infrared spectral chip for on-field sensing
Kaylee Hakkel, Maurangelo Petruzzella, Fang Ou, Anne van Klinken, Francesco Pagliano, Tianran Liu, Rene van Veldhoven, Andrea Fiore
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Proceedings Volume 11682, Optical Components and Materials XVIII; 1168218 (2021) https://doi.org/10.1117/12.2577548
Event: SPIE OPTO, 2021, Online Only
Abstract
We have developed a near-infrared spectral sensor chip capable of classifying different materials and quantifying their composition. The core device consists of an array of pixels having distinct spectral responses covering the 900-1700 nm wavelength region. Each pixel consists of a resonant-enhanced photodetector comprising an absorbing layer and a tuning element embedded in a vertical cavity. The chip is based on a III-V/Silicon hybrid technology and enables easy customization of the wavelength response and high responsivity. Its robustness, small dimensions and single-shot operation make this sensor suitable for portable spectroscopic applications in the agro-food sector.
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Kaylee Hakkel, Maurangelo Petruzzella, Fang Ou, Anne van Klinken, Francesco Pagliano, Tianran Liu, Rene van Veldhoven, and Andrea Fiore "An integrated near-infrared spectral chip for on-field sensing", Proc. SPIE 11682, Optical Components and Materials XVIII, 1168218 (5 March 2021); https://doi.org/10.1117/12.2577548
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KEYWORDS
Sensors
Interferometers
Near infrared spectroscopy
Optical components
Optical filters
Photodetectors
Point-of-care devices
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