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5 March 2021 An integrated near-infrared spectral chip for on-field sensing
Kaylee Hakkel, Maurangelo Petruzzella, Fang Ou, Anne van Klinken, Francesco Pagliano, Tianran Liu, Rene van Veldhoven, Andrea Fiore
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Abstract
We have developed a near-infrared spectral sensor chip capable of classifying different materials and quantifying their composition. The core device consists of an array of pixels having distinct spectral responses covering the 900-1700 nm wavelength region. Each pixel consists of a resonant-enhanced photodetector comprising an absorbing layer and a tuning element embedded in a vertical cavity. The chip is based on a III-V/Silicon hybrid technology and enables easy customization of the wavelength response and high responsivity. Its robustness, small dimensions and single-shot operation make this sensor suitable for portable spectroscopic applications in the agro-food sector.
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© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kaylee Hakkel, Maurangelo Petruzzella, Fang Ou, Anne van Klinken, Francesco Pagliano, Tianran Liu, Rene van Veldhoven, and Andrea Fiore "An integrated near-infrared spectral chip for on-field sensing", Proc. SPIE 11682, Optical Components and Materials XVIII, 1168218 (5 March 2021); https://doi.org/10.1117/12.2577548
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KEYWORDS
Sensors

Interferometers

Near infrared spectroscopy

Optical components

Optical filters

Photodetectors

Point-of-care devices

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