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5 March 2021 InP and Si photonic integrated circuits for smart imaging and computing
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Photonic integrated circuits (PICs) have been a powerful tool in advanced optical communication systems but now their application fields are expanding into those of sensing, imaging, and computing. Indium phosphide (InP), which is a traditional material for telecom PICs, is also good in other applications because it gives higher speed and functionality. Silicon PICs on the other hand gives us higher level of integration and manufacturability. Both approaches are to be utilized, depending on user’s requirements. In this talk, our photonic phased array integrated circuits on InP and silicon, as well as their applications to one pixel imaging, are reviewed. Then, as an example of PICs for computing, our optical unitary converter integrated circuits (OUCs) mainly on silicon toward all-optical multi-input multi-output (MIMO) processors are introduced.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshiaki Nakano and Takuo Tanemura "InP and Si photonic integrated circuits for smart imaging and computing", Proc. SPIE 11690, Smart Photonic and Optoelectronic Integrated Circuits XXIII, 116900L (5 March 2021);

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