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Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (IOX) single-mode waveguides for photonic integrated circuit (PIC) packaging and fiber cable connectivity is demonstrated in an effort to reduce the overall packaging complexity. The single-mode glass waveguides were fabricated and evaluated to be thermally stable at 110ºC for more than 5 years. Laser singulated optical end-facets and laser-formed passive alignment features yield an average connector loss of 0.68 dB when end-coupled to standard MTP- 16™ connectors.
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Lars Brusberg, Jason R. Grenier, Matthew J. Dejneka, Chad C. Terwilliger, Katerina Rousseva, "Thermally stable single-mode glass waveguides with fiber connectors for co-packaged optics," Proc. SPIE 11692, Optical Interconnects XXI, 116920K (5 March 2021); https://doi.org/10.1117/12.2578654