Photonic integration: from wafer level to the module

Christian Bosshard; Rolando Ferrini; Stefan Mohrdiek; Oscar Fernandez; Ton Offermans; Roger Krähenbühl; Angelique Luu-Dinh; Frederic Zanella; Guillaume Basset; Rony Jose James; Mark Fretz; Guido Spinola Durante; Amir Ghadimi

doi:10.1117/12.2578669

5 March 2021 Photonic integration: from wafer level to the module

Christian Bosshard, Rolando Ferrini, Stefan Mohrdiek, Oscar Fernandez, Ton Offermans, Roger Krähenbühl, Angelique Luu-Dinh, Frederic Zanella, Guillaume Basset, Rony Jose James, Mark Fretz, Guido Spinola Durante, Amir Ghadimi

Author Affiliations +

Proceedings Volume 11692, Optical Interconnects XXI; 116920Q (2021) https://doi.org/10.1117/12.2578669
Event: SPIE OPTO, 2021, Online Only

Abstract

Photonics integration continues to be a main driver for innovation in multiple aspects, including wafer-scale integration, new materials, sub-micron alignment of components and protection from harsh environment. We show cost-effective fabrication technologies of micro-optical components by UV wafer-scale replication into chemically stable polymers. Furthermore, for simplified fiber coupling and packaging, a novel 90° optical interconnect is presented, integrated with self-alignment structures. Replicated, space compliant microlenses on packaged CMOS imagers show improved light sensitivity by a factor 1.8. A laser based, low stress bonding process is explored to generate wafer-scale hermetic enclosures for harsh environment applications ranging from space to implants.

Conference Presentation

Citation Download Citation

Christian Bosshard, Rolando Ferrini, Stefan Mohrdiek, Oscar Fernandez, Ton Offermans, Roger Krähenbühl, Angelique Luu-Dinh, Frederic Zanella, Guillaume Basset, Rony Jose James, Mark Fretz, Guido Spinola Durante, and Amir Ghadimi "Photonic integration: from wafer level to the module", Proc. SPIE 11692, Optical Interconnects XXI, 116920Q (5 March 2021); https://doi.org/10.1117/12.2578669

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