Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors

Atul Joshi; David J. Chiaverini; Sachin Kashyap; Vishwanath Madhugiri; Robert Patti; Sangki Hong; Michael Lesser

doi:10.1117/12.2588181

12 April 2021 Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors

Atul Joshi, David J. Chiaverini, Sachin Kashyap, Vishwanath Madhugiri, Robert Patti, Sangki Hong, Michael Lesser

Proceedings Volume 11723, Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII; 1172308 (2021) https://doi.org/10.1117/12.2588181
Event: SPIE Defense + Commercial Sensing, 2021, Online Only

Abstract

An 8-inch wafer scale process was developed that provides low cost availability of back-side illuminated (BSI) imaging sensors. The process has been optimized to convert standard CMOS and CCD 6-inch or 8-inch wafers from front side illuminated (FSI) sensors to BSI sensors. The process successfully demonstrates wafer planarization, bow correction, bonding to carrier wafers, wafer thinning, re-planarization, anti-reflection coating, through silicon vias (TSVs) and back side metallization. Good wafer thinning control was obtained for a wide range of epi thicknesses varying from 4 microns to 15 microns. The thinner epi is optimized for UV and visible sensing while the thicker epi material is optimized for near-infrared (NIR) sensing. The processed wafers demonstrate backside passivation and anti-reflection (AR) coatings that optimize the QE performance in a variety of bands such as 200nm-300nm, 300nm-400nm and 400nm-900nm.

Conference Presentation

Citation Download Citation

Atul Joshi, David J. Chiaverini, Sachin Kashyap, Vishwanath Madhugiri, Robert Patti, Sangki Hong, and Michael Lesser "Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors", Proc. SPIE 11723, Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII, 1172308 (12 April 2021); https://doi.org/10.1117/12.2588181

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available