23 January 1990 Board Level High Speed Photonic Interconnections: Recent System Developments
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Abstract
The device requirements and system design issues for board-level optical links differ from their counterparts in optical links used for longer distance communications. We have fabricated a research prototype of a board-level optical link which is designed to operate in a high-speed digital equipment internal interconnect environment. The experimental transmitter and receiver packages are specifically designed for subminiaturized applications. We have explored the use of photolithographically patterned waveguides made of polymers as an alternative to the use of fiber at the board level. The major aspects of the device design are reviewed, but the emphasis of this paper is the systems-level design issues. We will discuss the design goals and the performance of the link. The results of this work demonstrate the feasibility of optics for signal distribution at the board level.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gail R. Lalk, Penny D. Smith, David W. Emmetts, Davis H. Hartman, "Board Level High Speed Photonic Interconnections: Recent System Developments", Proc. SPIE 1178, Optical Interconnects in the Computer Environment, (23 January 1990); doi: 10.1117/12.963377; https://doi.org/10.1117/12.963377
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