Investigation Of Photoablation As A Patterning Technique For Silicon Based Integrated Circuits: Laser Ablation And Physical Damage Threshold Considerations

D. L. Singleton; G. Paraskevopoulos; A. D. Buckthought; R. S. Irwin; G. S. Jolly; I.T. Ali Emesh

doi:10.1117/12.963916

5 February 1990 Investigation Of Photoablation As A Patterning Technique For Silicon Based Integrated Circuits: Laser Ablation And Physical Damage Threshold Considerations

D. L. Singleton, G. Paraskevopoulos, A. D. Buckthought, R. S. Irwin, G. S. Jolly, I.T. Ali Emesh

Author Affiliations +

Proceedings Volume 1186, Surface and Interface Analysis of Microelectronic Materials Processing and Growth; (1990) https://doi.org/10.1117/12.963916
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States

Abstract

Damage threshold energies for a pulsed XeCl excimer laser at 308nm have been obtained for a number of microelectronic materials which may have patterning applications. A photoacoustic technique is used to identify the damage process. An example of laser patterning illustrating the constraints on laser energy is given.

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D. L. Singleton, G. Paraskevopoulos, A. D. Buckthought, R. S. Irwin, G. S. Jolly, and I.T. Ali Emesh "Investigation Of Photoablation As A Patterning Technique For Silicon Based Integrated Circuits: Laser Ablation And Physical Damage Threshold Considerations", Proc. SPIE 1186, Surface and Interface Analysis of Microelectronic Materials Processing and Growth, (5 February 1990); https://doi.org/10.1117/12.963916

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