Photoelectrochemically Induced Copper Deposition On P-Silicon Electrodes From CuCN Solutions

N. T. Silva; G. P. Thim; A. W. Mol; V. Baranauskas

doi:10.1117/12.963924

5 February 1990 Photoelectrochemically Induced Copper Deposition On P-Silicon Electrodes From CuCN Solutions

N. T. Silva, G. P. Thim, A. W. Mol, V. Baranauskas

Proceedings Volume 1186, Surface and Interface Analysis of Microelectronic Materials Processing and Growth; (1990) https://doi.org/10.1117/12.963924
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States

Abstract

We have studied the mechanisms of the copper metallization on P-silicon wafers immersed in CuCN solutions, using photoelectrochemical measurements and optical/electron microscopy. In this process the electroplating is enhanced by the minority carries in illuminated areas of the silicon. cathode. The photo-selective deposition with high resolution have been obtained only on low doped P-silicon. The kinectics of the film growth is strongly dependent on the film thickness, and two mechanisms have been identified. Patterns of resolution of ~4 microns can be realized only with thickness bellow ~20 nm. Further investigation is needed for prevent the oxidation of the as-deposited film.

Citation Download Citation

N. T. Silva, G. P. Thim, A. W. Mol, and V. Baranauskas "Photoelectrochemically Induced Copper Deposition On P-Silicon Electrodes From CuCN Solutions", Proc. SPIE 1186, Surface and Interface Analysis of Microelectronic Materials Processing and Growth, (5 February 1990); https://doi.org/10.1117/12.963924

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