15 February 1990 Process Integration: The Future of Chipmaking
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Proceedings Volume 1188, Multichamber and In-Situ Processing of Electronic Materials; (1990); doi: 10.1117/12.963938
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States
Abstract
As with any concept in its early stages or realization, there are many ways of thinking about what we call "process integration" in semiconductor manufacturing. In its most simple form, we consider it to be the combining of two or more sequential processing steps, normally performed in separate systems, into a unified process flow within one fabrication tool.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David N. K. Wang, "Process Integration: The Future of Chipmaking", Proc. SPIE 1188, Multichamber and In-Situ Processing of Electronic Materials, (15 February 1990); doi: 10.1117/12.963938; https://doi.org/10.1117/12.963938
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KEYWORDS
Semiconducting wafers

Chemical vapor deposition

Dielectrics

Process control

Wafer manufacturing

Etching

Manufacturing

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