Paper
6 April 1990 Rapid Thermal Multiprocessing For Micro Factories
Krishna C. Saraswat, Len Booth, David D. Grossman, B. T. Khuri-Yakub, Yong Jin Lee, Mehrdad M. Moslehi, Samuel Wood
Author Affiliations +
Proceedings Volume 1189, Rapid Isothermal Processing; (1990) https://doi.org/10.1117/12.963953
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States
Abstract
Future success in microelectronics will demand rapid innovation, rapid product introduction and ability to react to a change in technological and business climate quickly. These technological advances in integrated electronics will require development of flexible manufacturing technology for VLSI systems. However, the current approach of establishing megafactories for mass manufacturing of chips will lead to a skyrocketing cost of more than 1 billion dollars to establish a factory by the end of this century. This could result in serious attrition of chip manufacturers. We propose new concepts of a programmable micro factory which may be characterized by more economical small scale production, higher flexibility to accommodate many products on several processes, and faster turnaround and learning. In-situ multi-processing equipment where several process steps can be done in sequence may be a key ingredient in this approach. For this environment to be flexible, the equipment must have ability to change processing environment, requiring extensive in-situ measurements and real time control. In-process and end-of-process measurements coupled with rapid learning through expert systems will facilitate faster innovation and better ability to react to a change.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Krishna C. Saraswat, Len Booth, David D. Grossman, B. T. Khuri-Yakub, Yong Jin Lee, Mehrdad M. Moslehi, and Samuel Wood "Rapid Thermal Multiprocessing For Micro Factories", Proc. SPIE 1189, Rapid Isothermal Processing, (6 April 1990); https://doi.org/10.1117/12.963953
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Cited by 8 scholarly publications.
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KEYWORDS
Semiconducting wafers

Manufacturing

Plasma

Silicon

Temperature metrology

Dielectrics

Metals

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