Paper
23 August 2021 Beyond EUV measurement at NewSUBARU synchrotron light facility
Takuto Fujii, Shinji Yamakawa, Tetsuo Harada, Takeo Watanabe
Author Affiliations +
Abstract
In 2019, EUV lithography technology with a wavelength of 13.5 nm was used for the mass production of semiconductor logic devices with 7 nm node. As with small feature size of electronic circuits in semiconductor device will be required in the future, beyond EUV (BEUV) lithography with exposure wavelength around 6.7 nm is a candidate for the next generation lithography. In BEUV, the developments of high-reflective multilayers, high-sensitive resists, and high-power light sources are critical issues. Thus, we have developed BEUV evaluation tools in NewSUBARU synchrotron light facility. Accurate BEUV reflectometry is significant for the development of high-reflective BEUV multilayer. For the accurate reflectometry, higher-diffraction-order generated from a monochromator should be suppressed. At the BL10 beamline at NewSUBARU, the components of second and third-diffraction-order light are 7% mixed into the BEUV measurement light. Mo transmission filter with a 200-nm-thick was previously used to suppress the higher-order light to 1/10, which was insufficient for target accuracy of 0.1%. We have developed a high-order-light cutting unit consisting of two mirrors with TiO2 coating, which suppressed the high-order light to 1/100.
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takuto Fujii, Shinji Yamakawa, Tetsuo Harada, and Takeo Watanabe "Beyond EUV measurement at NewSUBARU synchrotron light facility", Proc. SPIE 11908, Photomask Japan 2021: XXVII Symposium on Photomask and Next-Generation Lithography Mask Technology, 119080T (23 August 2021); https://doi.org/10.1117/12.2600986
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KEYWORDS
Reflectivity

Mirrors

Multilayers

Molybdenum

Reflectometry

Coating

Extreme ultraviolet lithography

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