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1 February 1990 Using the CESM Shell to Classify Wafer Defects from Visual Data
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Proceedings Volume 1197, Automated Inspection and High-Speed Vision Architectures III; (1990) https://doi.org/10.1117/12.969935
Event: 1989 Symposium on Visual Communications, Image Processing, and Intelligent Robotics Systems, 1989, Philadelphia, PA, United States
Abstract
Automatic visual wafer inspection will increase productivity and improve product quality of integrated circuit (IC) chips on wafers. Recently, research on such inspection has been focused on problems for classification of defects on wafers to rectify wafer fabrication errors by comparing them with predefined specification standards. This paper describes the development of a knowledge-based system which classifies defects in the recti-linear type wafer images for VLSI chips. A consultation system shell called CESM (Classification Expert System Maker) has been used to develop the classification system. CESM supports integration of low level processing, feature extraction, and final decision stages.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sung-Do Chi, Bernard P. Zeigler, and Tag Gon Kim "Using the CESM Shell to Classify Wafer Defects from Visual Data", Proc. SPIE 1197, Automated Inspection and High-Speed Vision Architectures III, (1 February 1990); https://doi.org/10.1117/12.969935
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