1 February 1990 Vision Algorithms For VLSI Wafer Probing
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Proceedings Volume 1197, Automated Inspection and High-Speed Vision Architectures III; (1990) https://doi.org/10.1117/12.969934
Event: 1989 Symposium on Visual Communications, Image Processing, and Intelligent Robotics Systems, 1989, Philadelphia, PA, United States
This paper deals with an important problem encountered in automating VLSI wafer probing. In this automation, vision is used for accurately guiding and lowering a probe to make contact with the wafer. In this paper, we discuss various algorithms used in measurement of the distance of the micro-manipulator from the wafer surface. In particular, we describe algorithms for alignment of consecutive frames of the wafer, separation of probe and wafer regions, and getting a clean image of the probe by eliminating traces of the background patterns. We also describe a three-level procedure for obtaining the proximity of the probe from the wafer. These algorithms are verified with the experimental data.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. V. Dantu, R. V. Patel, N. J. Dimopoulos, A. J. Al-Khalili, "Vision Algorithms For VLSI Wafer Probing", Proc. SPIE 1197, Automated Inspection and High-Speed Vision Architectures III, (1 February 1990); doi: 10.1117/12.969934; https://doi.org/10.1117/12.969934


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