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4 March 2022 Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process
Jan Vanda, Mihai-George Muresan, Pavel Cech, Martin Mydlar, Katerina Pilna, Martin Smrz, Michal Chyla, Jiri Muzik, Denisa Stepankova, Jan Brajer, Tomas Mocek, Bohumil Stoklasa, Stepan Venos, Jiri Kucharik
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Proceedings Volume 11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII; 1198804 (2022) https://doi.org/10.1117/12.2610143
Event: SPIE LASE, 2022, San Francisco, California, United States
Abstract
Glass sheets with ~ 0.1 mm thickness are a promising material from which interposers for high density chip packaging can be produced due to its electrical and mechanical properties. For successful application in microelectronics, it is necessary to develop a way of efficient, high-speed production of interconnecting holes through such glass substrate, socalled through glass vias (TGVs). One of the most promising technique is Laser-Induced Deep Etching (LIDE), where picosecond laser is used to modified particular areas on the glass substrate. Then, using wet etching process, the area exposed to the laser will be etched more quickly than unexposed area. However, effective and large-scale glass modification often requires use of high-energy pulsed UV laser source, which unnecessary complicates the whole application. Here we present effective preparation of treated glass substrate using Yb:YAG laser at its fundamental wavelength 1030 nm, which is capable to overcome such disadvantage. We induced 5-15 m diameter regular affected areas on ~100 m substrate at various pitch, enabling scaled-up production of precise TGVs.
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Jan Vanda, Mihai-George Muresan, Pavel Cech, Martin Mydlar, Katerina Pilna, Martin Smrz, Michal Chyla, Jiri Muzik, Denisa Stepankova, Jan Brajer, Tomas Mocek, Bohumil Stoklasa, Stepan Venos, and Jiri Kucharik "Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process", Proc. SPIE 11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII, 1198804 (4 March 2022); https://doi.org/10.1117/12.2610143
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KEYWORDS
Glasses
Pulsed laser operation
Etching
Laser damage threshold
Laser development
Laser processing
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