Challenges of design and fabrication technology of plasmonic components for Photonic Integrated Circuits

Vadym Zayets; Iryna Serdeha; Valerii Grygoruk

doi:10.1117/12.2612797

5 March 2022 Challenges of design and fabrication technology of plasmonic components for Photonic Integrated Circuits

Vadym Zayets, Iryna Serdeha, Valerii Grygoruk

Proceedings Volume 12004, Integrated Optics: Devices, Materials, and Technologies XXVI; 120040O (2022) https://doi.org/10.1117/12.2612797
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

The two unique features of the plasmonic isolator and the plasmonic modulator are their small size of about 10-100 μm and their technological compatibility with the Photonic Integrated Circuits (PIC). These features make them attractive as components for a denser and smaller PIC. An additional advantage of the plasmonic modulator is its ultra-fast operational speed, which exceeds 200 GHz. We have developed and experimentally demonstrated two fabrication technologies, which allow a substantial decrease of both the plasmonic propagation loss and the coupling loss. The developed technologies are based on the optimization of the out-of-plane confinement and the in-plane confinement for a surface plasmon. A low propagation loss of 0.7 dB/μm for a surface plasmon in a Co/TiO₂/SiO₂ plasmonic structure on a Si substrate and a moderate coupling efficiency of 4 dB per facet between a Co/TiO₂/SiO₂ and a Si nanowire waveguide were achieved.

Conference Presentation

Citation Download Citation

Vadym Zayets, Iryna Serdeha, and Valerii Grygoruk "Challenges of design and fabrication technology of plasmonic components for Photonic Integrated Circuits", Proc. SPIE 12004, Integrated Optics: Devices, Materials, and Technologies XXVI, 120040O (5 March 2022); https://doi.org/10.1117/12.2612797

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