Open Access Paper
16 June 2022 Front Matter: Volume 12052
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 12052, including the Title Page, Copyright information, Table of Contents, and Conference Committee listings.

24–28 April 2022

San Jose, California, United States

23–27 May 2022 ONLINE

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The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

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Author(s), “Title of Paper,” in DTCO and Computational Patterning, edited by Ryoung-Han Kim, Neal V. Lafferty, Proc. of SPIE 12052, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510649798

ISBN: 9781510649804 (electronic)

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Conference Committee

Symposium Chairs

Kafai Lai, University of Hong Kong (United States)

Symposium Co-Chair

Qinghuang Lin, LAM Research Corporation (United States)

Conference Chair

Ryoung-Han Kim, IMEC (Belgium)

Conference Co-Chair

Neal V. Lafferty, Mentor, a Siemens Business (United States)

Conference Program Committee

Jason P. Cain, Advanced Micro Devices, Inc. (United States)

Lifu Chang, MOSIS Integrated Circuit Fabrication Service (United States)

Dan J. Dechene, IBM Thomas J. Watson Research Center (United States)

Yuri Granik, Siemens Industry Software Inc. (United States)

Harsha Grunes, Intel Corporation (United States)

Srividya Jayaram, Mentor, a Siemens Business (United States)

Sungwoo Ko, SK Hynix, Inc. (Korea, Republic of)

Sachiko Kobayashi, KIOXIA Corporation (Japan)

Kafai Lai, The University of Hong Kong (United States)

Ya-Chieh Lai, Cadence Design Systems, Inc. (United States)

Lars W. Liebmann, TEL Technology Ctr., America, LLC (United States)

Kevin Lucas, Synopsys, Inc. (United States)

Larry Melvin, Intel Corporation (United States)

Shigeki Nojima, KIOXIA Corporation (Japan)

David Z. Pan, The University of Texas at Austin (United States)

Piyush Pathak, Cadence Design Systems, Inc. (United States)

Michael L. Rieger, Consultant (United States)

Vivek K. Singh, Intel Corporation (United States)

Kunal N. Taravade, Synopsys, Inc. (United States)

Chun-Ming Wang, Western Digital Corporation (United States)

Lynn T. Wang, GLOBALFOUNDRIES Inc. (United States)

Yayi Wei, Institute of Microelectronics, Chinese Academy of Sciences (United States)

Chi-Min Yuan, NXP Semiconductors (United States)

© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 12052", Proc. SPIE 12052, DTCO and Computational Patterning, 1205201 (16 June 2022); https://doi.org/10.1117/12.2643412
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KEYWORDS
Machine learning

Integrated circuit design

Data modeling

Optimization (mathematics)

Optical lithography

Extreme ultraviolet lithography

Image processing

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