A novel methodology for wafer-level scanner focus spot capture and back-tracing mechanism

Chieh-Chen Chiu; Mingqi Gao; Feng Tian; Wei Feng; Andy Lan; Dan Li; Shengyuan Zhong; Aijiao Zhu; Ningqi Zhu; Yunchen Xu; Jin Zhu; Jincheng Pei; Kevin Huang

doi:10.1117/12.2627284

26 May 2022 A novel methodology for wafer-level scanner focus spot capture and back-tracing mechanism

Chieh-Chen Chiu, Mingqi Gao, Feng Tian, Wei Feng, Andy Lan, Dan Li, Shengyuan Zhong, Aijiao Zhu, Ningqi Zhu, Yunchen Xu, Jin Zhu, Jincheng Pei, Kevin Huang

Author Affiliations +

Proceedings Volume 12053, Metrology, Inspection, and Process Control XXXVI; 120530U (2022) https://doi.org/10.1117/12.2627284
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Abstract

As lithography patterning focus tolerance shrinkage in advanced production fab, defocus due to scanner wafer table or pre-layer contamination has been considered as a yield-loss killer and wafer scrap contributor. Traditionally, we can only apply a fixed by-wafer/by-zone spec to monitor leveling performance, lacking flexibility for further defense system design or root-cause analysis. In this paper we develop a comprehensive solution to capture focus/chuck spot in a high-volume manufacturing environment. This algorithm can automatically detect and categorize defocus spot into focus and chuck spots. Meanwhile, this algorithm produces an overlapped map for back-tracing pre-stage contamination and regularly send an alarm in customized schedule to prevent serious yield loss.

Conference Presentation

Citation Download Citation

Chieh-Chen Chiu, Mingqi Gao, Feng Tian, Wei Feng, Andy Lan, Dan Li, Shengyuan Zhong, Aijiao Zhu, Ningqi Zhu, Yunchen Xu, Jin Zhu, Jincheng Pei, and Kevin Huang "A novel methodology for wafer-level scanner focus spot capture and back-tracing mechanism", Proc. SPIE 12053, Metrology, Inspection, and Process Control XXXVI, 120530U (26 May 2022); https://doi.org/10.1117/12.2627284

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