Paper
4 May 2022 A novel 3300V conductivity modulation enhanced IGBT with P-type Schottky contact and partial N-type buried layer
Yifei Lan, Jinping Zhang, Rongrong Zhu, Jiang Liu, Rui Jin, Yaohua Wang, Bo Zhang
Author Affiliations +
Proceedings Volume 12172, International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021); 121721W (2022) https://doi.org/10.1117/12.2634548
Event: International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021), 2021, Nanchang, China
Abstract
A novel 3300V conductivity modulation enhanced planar gate IGBT (CE-IGBT) with P-type Schottky contact and partial N-type buried layer is proposed. The proposed CE-IGBT features a P-type Schottky contact between the P-base region and emitter metal as well as a partial highly-doped N-type buried layer located in the P-base region. The Schottky contact forms a hole barrier by increasing the potential of the P-base region and the N-type buried layer suppresses the hole flowing above it. The simulation results show that compared with the conventional planar gate IGBT (Con-IGBT), the proposed CE-IGBT not only reduces the on-state voltage drop (Vceon) but also improves the trade-off relationship between the Vceon and turn-off power loss (Eoff). Compared with the Con-IGBT, the Vceon of the CE-IGBT with same P-base doping concentration is reduced by 32.7%, and the CE-IGBT pro with same threshold voltage (Vth) is reduced by 30.9%. At same Vceon of 2.65 V, compared with the Con-IGBT, the Eoff of the CE-IGBT and CE-IGBT pro is reduced by 37.3% and 34.9%, respectively. Moreover, the proposed device demonstrates good reverse biased safe operating area (RBSOA).
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yifei Lan, Jinping Zhang, Rongrong Zhu, Jiang Liu, Rui Jin, Yaohua Wang, and Bo Zhang "A novel 3300V conductivity modulation enhanced IGBT with P-type Schottky contact and partial N-type buried layer", Proc. SPIE 12172, International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021), 121721W (4 May 2022); https://doi.org/10.1117/12.2634548
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KEYWORDS
Field effect transistors

Modulation

Metals

Doping

Reliability

Computer simulations

Oxides

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