1 May 1990 Stackable wafer-thin coolers for high-power laser-diode arrays
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An advanced cooling technique has been developed to remove very high heat flux levels from two-dimensional arrays of GaAs laser diode bars using stackable wafer thin coolers. The thermal performance of these coolers is expected to surpass previous versions, and a unique sealing technique has been designed to allow these coolers to be packaged in a very compact arrangement. The cooler design and fabrication, coolant manifold and sealing, and test procedure are described.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert E. Hendron, Robert E. Hendron, C. C. Becker, C. C. Becker, Joseph L. Levy, Joseph L. Levy, John E. Jackson, John E. Jackson, "Stackable wafer-thin coolers for high-power laser-diode arrays", Proc. SPIE 1219, Laser Diode Technology and Applications II, (1 May 1990); doi: 10.1117/12.18271; https://doi.org/10.1117/12.18271

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