Low persistence H1RG InGaAs FPA development for Micro-Cam

Michael Grzesik; Jongwoo Kim; Henry Yuan; Mark Farris; Kevin Peralta; Luis Gordillo

doi:10.1117/12.2636081

30 September 2022 Low persistence H1RG InGaAs FPA development for Micro-Cam

Michael Grzesik, Jongwoo Kim, Henry Yuan, Mark Farris, Kevin Peralta, Luis Gordillo

Proceedings Volume 12234, Infrared Sensors, Devices, and Applications XII; 1223406 (2022) https://doi.org/10.1117/12.2636081
Event: SPIE Optical Engineering + Applications, 2022, San Diego, California, United States

Abstract

Teledyne Judson Technologies (TJT), a subsidiary of Teledyne Imaging Sensors (TIS), and a TIS team in California have jointly developed a low persistence InGaAs focal plane array (FPA) for use in TIS’s MicroCam SWIR camera. This FPA is built on the Hawaii-1RG (H1RG) read-out integrated circuit (ROIC) which has 1024x1024 pixels with an 18 μm pixel pitch format. Operated at 77 K, the newly developed InGaAs arrays achieve cumulative persistence values of ~0.04-0.08% after 45s of integration. This paper reviews the InGaAs detector design and fabrication processes and FPA test results of low persistence focal plane arrays. The persistence test methodology and test data are also presented. A unique epi-wafer and detector structure was designed to allow for low persistence, low dark current, low bad pixel count, high uniformity, and large reverse bias operation (1.5V). The FPA test data is presented for persistence, dark current, quantum efficiency (QE), and correlated double sampling (CDS) noise, as well as bad pixel count and clusters.

Conference Presentation

Citation Download Citation

Michael Grzesik, Jongwoo Kim, Henry Yuan, Mark Farris, Kevin Peralta, and Luis Gordillo "Low persistence H1RG InGaAs FPA development for Micro-Cam", Proc. SPIE 12234, Infrared Sensors, Devices, and Applications XII, 1223406 (30 September 2022); https://doi.org/10.1117/12.2636081

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