Laser dicing of glass wafer products into sub-millimeter sized dies

Jason R. Grenier; Andreas S. Gaab; Nicolai Haenel; Elisabeth Rosier

doi:10.1117/12.2653262

17 March 2023 Laser dicing of glass wafer products into sub-millimeter sized dies

Jason R. Grenier, Andreas S. Gaab, Nicolai Haenel, Elisabeth Rosier

Proceedings Volume 12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII; 124080A (2023) https://doi.org/10.1117/12.2653262
Event: SPIE LASE, 2023, San Francisco, California, United States

Abstract

The use of glass wafers for optical and electronic device substrates requires a high-quality, high throughput dicing solution. The patented Corning® laser nanoPerforation process is well-established in multiple industrial applications for glass cutting. A key attribute is the homogeneous appearance of the side wall over the full thickness of the glass and its high edge quality with low chipping and high throughput performance. Combining this laser-based solution with the mechanical breaking technology by Dynatex provides a complete and scalable path for glass wafer dicing applicable to normal, as well as very small die sizes. Detailed investigations on several different glass wafer materials have demonstrated the current capabilities for this laser and mechanical singulation process and confirm the exceptional performance. A tiny die size of 150×150 μm is demonstrated on a 200 mm diameter, 150 μm thick glass wafer. The laser-based solution can be enhanced to ensure side-wall uniformity at the large number of intersecting lines found on densely packed wafers. Finally, the requirements of the clear aperture for the laser entrance can be reduced into the range below 100 μm by applying Corning’s fundamental process understanding and optimization of the laser optics.

Conference Presentation

Citation Download Citation

Jason R. Grenier, Andreas S. Gaab, Nicolai Haenel, and Elisabeth Rosier "Laser dicing of glass wafer products into sub-millimeter sized dies", Proc. SPIE 12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII, 124080A (17 March 2023); https://doi.org/10.1117/12.2653262

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