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17 March 2023 Microprocessing with a multi-plane light conversion beam shaper and a femtosecond laser at 515nm
Clément Jacquard, Kathrin Placzek, Daniel Holder, Dmitry Nuzhdin, Mahmoud Ziat, Ivan Gusachenko, Gwenn Pallier, Guillaume Labroille, Pu Jian
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Proceedings Volume 12409, Laser-based Micro- and Nanoprocessing XVII; 1240910 (2023) https://doi.org/10.1117/12.2655447
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
We describe how to improve micro-processing using Second Harmonic Generation of a Ultra-Short Pulse laser combined with a Multi-Plane Light Conversion beam-shaper. Manufacturing at 515nm presents advantages compared to 1030nm : extended depth of field, higher sharpness, and higher ablation efficiency for some materials. The beam-shaper provides a square top-hat with a 1/10 sharpness and an extended depth of field up to 10 times higher compared to other beam-shaping technologies. We describe process results of different metal samples: LIPSS generation with a 100µm square targeting a period down to 0,5µm and holes drilling holes of a diameter smaller than 10µm.
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Clément Jacquard, Kathrin Placzek, Daniel Holder, Dmitry Nuzhdin, Mahmoud Ziat, Ivan Gusachenko, Gwenn Pallier, Guillaume Labroille, and Pu Jian "Microprocessing with a multi-plane light conversion beam shaper and a femtosecond laser at 515nm", Proc. SPIE 12409, Laser-based Micro- and Nanoprocessing XVII, 1240910 (17 March 2023); https://doi.org/10.1117/12.2655447
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KEYWORDS
Beam shaping
Femtosecond phenomena
Laser applications
Manufacturing
Harmonic generation
Laser ablation
Laser processing
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