A description is presented of the design and performance of several large-area CCD imagers, including large 1-in. TV imagers, and very large multi-output buttable devices. A photocomposition technique is described which permits the area limitations of the wafer stepper to be surmounted, thus allowing the manufacture of very large devices. The design and performance of a 1-in. format 875-line CCD are reported, as well as the 525- and 625-line variants. A series schematic and design specifications are given for a three-phase, nonantibloomed, buried channel frame transfer CCD. The incorporation of the photocomposition technique, called stitching, in CCD devices is explained. Performance testing results and previous applications are mentioned. The CCDs show low readout noise and may be butted into large arrays, and can handle high amounts of charge at high speed. The products are shown to achieve their design targets, and an extra degree of freedom in image-area limitations is created by applying the autoalign capability of the wafer stepper.