New functional surface treatment process and primers for high-NA EUV lithography

Wataru Shibayama; Shuhei Shigaki; Satoshi Takeda; Kodai Kato; Makoto Nakajima; Rikimaru Sakamoto

doi:10.1117/12.2659979

30 April 2023 New functional surface treatment process and primers for high-NA EUV lithography

Wataru Shibayama, Shuhei Shigaki, Satoshi Takeda, Kodai Kato, Makoto Nakajima, Rikimaru Sakamoto

Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 124980O (2023) https://doi.org/10.1117/12.2659979
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

For EUV high NA lithography, current conventional tri-layer process has the critical issue both for EUV litho performance & pattern etch transfer. Especially since the latest EUV PR including CAR and MOR is very low film thickness around 10nm, Si containing hard mask (Si-HM) should be around 5nm. In this case, it is too difficult to transfer to SOC and the bottom hard mask layer. In order to prevent this critical issue, we propose new functional surface treatment process and primers (FSTP) on the conventional CVD hard mask or Si-HM. This FSTP is spin coating materials. However it is almost single molecular type ultra thin primer (~1nm) for all of the CVD & spin on hard mask (SiON, SiN, TiN, SiO₂, SiHM, SOG and so on) not to bother fine pitch pattern transfer. Moreover, this FSTP has high universalithy to EUV PR CAR and MOR to achieve high patterning performance in EUVL. Therefore FSTP has big advantage in EUV litho process and pattern etch transfer for next generation High NA EUV process.

Conference Presentation

Citation Download Citation

Wataru Shibayama, Shuhei Shigaki, Satoshi Takeda, Kodai Kato, Makoto Nakajima, and Rikimaru Sakamoto "New functional surface treatment process and primers for high-NA EUV lithography", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124980O (30 April 2023); https://doi.org/10.1117/12.2659979

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