Poster + Paper
30 April 2023 Positive tone i-line photoresist with controlled undercut profile for advanced packaging
Author Affiliations +
Conference Poster
Abstract
With the progress of advanced packaging, the RDL metal line and μBump stability and super electrical performance were highly concerned. The photoresist with undercut profile is required to obtain the RDL metal line and μBump with footing. The AZ® 3DT-400 series formulation is a chemically amplified positive-tone i-line photoresist developed by EMD Electronics which a special additive was introduced to generate the undercut profile. The undercut size and shape can be adjusted with the loading of the additive. After optimizing the formulation, the desired undercut length larger than 10% of the target CD and the undercut height less than 10% of target CD were achieved.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Walter Weihong Liu, Chunwei Chen, Ping-Hung Lu, SookMee Lai, and Yoshiharu Sakurai "Positive tone i-line photoresist with controlled undercut profile for advanced packaging", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124981K (30 April 2023); https://doi.org/10.1117/12.2657694
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KEYWORDS
Photoresist materials

Copper

Semiconducting wafers

Film thickness

Advanced packaging

Metals

Baking

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