1 April 1990 Variable parameters for bonding heat seal connectors to flat panel displays
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Proceedings Volume 1257, Liquid Crystal Displays and Applications; (1990); doi: 10.1117/12.19936
Event: Electronic Imaging: Advanced Devices and Systems, 1990, Santa Clara, CA, United States
Abstract
This paper reports on a study of the three basic parameters involved in bonding heat seal connectors to flat panel displays. Those parameters are: temperature. at the bond, pressure at the bond, and the time that the temperature and pressure are applied to the bond.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James R. Bouldin, Roger R. Reinke, "Variable parameters for bonding heat seal connectors to flat panel displays", Proc. SPIE 1257, Liquid Crystal Displays and Applications, (1 April 1990); doi: 10.1117/12.19936; https://doi.org/10.1117/12.19936
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KEYWORDS
Connectors

LCDs

Flat panel displays

Adhesives

Particles

Glasses

Gold

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