1 June 1990 Characterization of a new inspection system
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This paper presents a fully automated inspection system answering to the growing need of in-process wafer control After a brief description of the mechanical, optical and image processing parts, we sum up our inspection method based on a robust and fast image comparison . One image is obtained directly from the die to inspect through an optical microscope . The other one may be: - the corresponding site on the neighbouring die ( die to die strategy) - areference image extracted from aleamed defect free library ( die to reference strategy) - a synthesized image from the CAD database ( die to database strategy) We give then some results for three functions of this system: - reticlequalification - defect density measurement on patterned wafers - control of die critical sites Defect localisations are memorized, and an interactive reviewing software allows to observe these defects with various optical conditions (magnification, wavelength, focus...).
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jean-Luc Jacquot, Jean-Luc Jacquot, Michel Darboux, Michel Darboux, Bernard Picard, Bernard Picard, Manouk Kuradjian, Manouk Kuradjian, "Characterization of a new inspection system", Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); doi: 10.1117/12.20045; https://doi.org/10.1117/12.20045

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