1 June 1990 Fully automatic measuring system for submicron lithography
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The Laser Interferometric X-Y Measuring System Model XY-21 has been used around the world for many years as the standard machine of measuring coordinate of reticles and masks for IC and LSI. However, indications are that the capability of the XY-2I may not be sufficient to match the ever increasing trend toward ultra large scale integration (ULSI). In response, we have recently developed a successor to the XY-2I,the Laser Interferometric X-Y Measuring System Model XY-3I. The new system is designed to meet the requirements of the ULSI era. The XY-3I enables very accurate, full automatic measurement of pattern coordinate on masks and reticles, as well as the critical dimension (CD). The system can handle the patterns on the wafers equally well, with the capabilities of highly accurate measurement of coordinate position, CD and overlay registration of pattern. An additional feature of the XY-3I is bow compensation, which decreases fluctuation among measurement data due to bow change of sample. This paper presents the improvements, new functions, performance and applications of the XY-.3I.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hisao Izawa, Hisao Izawa, Kenjiro Nakai, Kenjiro Nakai, Masami Seki, Masami Seki, } "Fully automatic measuring system for submicron lithography", Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); doi: 10.1117/12.20073; https://doi.org/10.1117/12.20073


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