1 June 1990 Increasing the dimensions of metrology
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Proceedings Volume 1261, Integrated Circuit Metrology, Inspection, and Process Control IV; (1990); doi: 10.1117/12.20071
Event: Microlithography '90, 1990, San Jose, CA, United States
Abstract
In any process that generates or measures pattern-placement (overlay), these parameters need to be regarded at least as two-dimensional. We show this on our procedure bringing a mask repeater under statistical process control SPC). In order to increase the accuracy of the overlay measurement process itself, plate bending has to be included as a third dimension. By taking the third dimension into account, the LMS 2000 Metrology System significantly reduces the maximum uncertainity of measurement results.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wilhelm Maurer, Carola Blaesing-Bangert, Hans-Helmut Paul, "Increasing the dimensions of metrology", Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); doi: 10.1117/12.20071; https://doi.org/10.1117/12.20071
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KEYWORDS
Photomasks

Metrology

Overlay metrology

Process control

Inspection

Integrated circuits

Semiconducting wafers

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