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1 June 1990 Novel cresol/chloroacetaldehyde novolacs for high-temperature resist applications
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A new class of novolacs has been developed which imparts a unique blend of sensitivity, submicron resolution and image thennai flow resistance to positive photoresist formulations. The novolac system is based upon condensation of metaand para-cresol with a chloroaceta!dehyde equivalent. The resists are based upon formulations of the new chloroacetaidehyde (CM) novolacs and typical diazonaphthoquinone photoactive compounds. The resist image thermal flow temperatures can exceed 200°C depending upon the molecular weight and composition of the novolac. As a result of the high thermal flow properties of the CM novolac, the resists are verb' stable to reticulation in aluminum or oxide plasma etching environments, eliminating the need for Deep UV curing.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas R. Sarubbi, Andrew J. Blakeney, Joseph J. Sizensky, Nancy N. Greene, Shinji Sakaguchi, Shiro Tan, and Gregory Luckman "Novel cresol/chloroacetaldehyde novolacs for high-temperature resist applications", Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990);


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