In the previous paper, you heard a description of the electron storage ring
system that IBM has ordered for X-ray Lithography. In this paper we shall
describe the facility that is being constructed for the ESR and explain some of
the decisions made in its design.
The facility, which we have dubbed ALF for Advanced Lithographic Facility,
is a part of the $O.5B Advanced Semiconductor Technology Center now being
occupied at IBM's East Fishkill, New York semiconductor plant. Ground was
broken in October of 1988 and the ALF building is expected to be ready for
occupancy in July of this year. At that time, initial preparations for
installation of the ESR and the lithographic tooling will begin. Bechtel
National of San Francisco is the Design-Build contractor.
As you may have concluded from Dave Andrew's paper, an ESR and its
associated cryogenic, cooling, power and control systems is a complex tool which
requires specialized support. In addition, the facility must support the
vibration control and clean room requirements of submicron lithographic
processing. Also, significant concerns of safety and security must be met. We
will now describe our solutions to these requirements.