Paper
1 June 1990 0.10-μm overlay for DRAM production using step and scan
Harry Sewell, Scott J. Smith, Daniel N. Galburt
Author Affiliations +
Abstract
The resolution capabilities of lithographic tools are being progressively pushed to allow the replication of increasingly smaller lithographic features1'2 The target for 0.5-micron resolution is almost past; 0.4-micron resolution is of keen interest; and the goal of 0.35 micron is just around the corner. The overlay requirements using the familiar rule of thumb of Overlay = Resolution I 4 indicates that a 0.10-micron (mean plus 3 sigma) specification is required for 0.40-micron resolution tools. This is not an easy task. We will explore it in the context of a Step-and-Scan' alignment system.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harry Sewell, Scott J. Smith, and Daniel N. Galburt "0.10-μm overlay for DRAM production using step and scan", Proc. SPIE 1264, Optical/Laser Microlithography III, (1 June 1990); https://doi.org/10.1117/12.20193
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KEYWORDS
Optical alignment

Semiconducting wafers

Reticles

Wafer-level optics

Distortion

Optical lithography

Signal detection

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