Presentation + Paper
5 October 2023 Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system
Author Affiliations +
Abstract
In recent years, the number of qubits in superconducting quantum computers has increased. It is anticipated that future attempts to realize fault-tolerant superconducting quantum computers will require an ability to fabricate large numbers of superconducting qubits uniformly on large-area substrates. Specifically, it is expected that technology will be developed to fabricate a large number of Josephson junctions on a 12-inch substrate in a short period with minimum dimensional variations in the superconducting quantum circuits. In this manuscript, we report on a technology that enables the uniform formation of resist patterns for Josephson junctions in large quantities on 12-inch substrates by replacing electron beam lithography with ArF immersion lithography.
Conference Presentation
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Satoru Odate, Naooki Saito, Kosuke Suzuki, Hajime Aoyama, Koichi Kusuyama, Yasunobu Nakamura, and Hiroyuki Tsukamoto "Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system", Proc. SPIE 12652, UV and Higher Energy Photonics: From Materials to Applications 2023, 1265205 (5 October 2023); https://doi.org/10.1117/12.2675964
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KEYWORDS
Immersion lithography

Fabrication

Superconductors

Semiconducting wafers

Quantum circuits

Quantum communications

Quantum computers

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