Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system

Satoru Odate; Naooki Saito; Kosuke Suzuki; Hajime Aoyama; Koichi Kusuyama; Yasunobu Nakamura; Hiroyuki Tsukamoto

doi:10.1117/12.2675964

5 October 2023 Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system

Satoru Odate, Naooki Saito, Kosuke Suzuki, Hajime Aoyama, Koichi Kusuyama, Yasunobu Nakamura, Hiroyuki Tsukamoto

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Proceedings Volume 12652, UV and Higher Energy Photonics: From Materials to Applications 2023; 1265205 (2023) https://doi.org/10.1117/12.2675964
Event: SPIE Nanoscience + Engineering, 2023, San Diego, California, United States

Abstract

In recent years, the number of qubits in superconducting quantum computers has increased. It is anticipated that future attempts to realize fault-tolerant superconducting quantum computers will require an ability to fabricate large numbers of superconducting qubits uniformly on large-area substrates. Specifically, it is expected that technology will be developed to fabricate a large number of Josephson junctions on a 12-inch substrate in a short period with minimum dimensional variations in the superconducting quantum circuits. In this manuscript, we report on a technology that enables the uniform formation of resist patterns for Josephson junctions in large quantities on 12-inch substrates by replacing electron beam lithography with ArF immersion lithography.

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(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

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Satoru Odate, Naooki Saito, Kosuke Suzuki, Hajime Aoyama, Koichi Kusuyama, Yasunobu Nakamura, and Hiroyuki Tsukamoto "Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system", Proc. SPIE 12652, UV and Higher Energy Photonics: From Materials to Applications 2023, 1265205 (5 October 2023); https://doi.org/10.1117/12.2675964

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