Research on board-level thermal dissipation of the mini LED in COB packaging

Wenli Wang; Yu Xiang

doi:10.1117/12.2687165

6 August 2023 Research on board-level thermal dissipation of the mini LED in COB packaging

Wenli Wang, Yu Xiang

Proceedings Volume 12781, International Conference on Optoelectronic Information and Functional Materials (OIFM 2023); 127810R (2023) https://doi.org/10.1117/12.2687165
Event: 2023 International Conference on Optoelectronic Information and Functional Materials (OIFM 2023), 2023, Guangzhou, JS, China

Abstract

In view of the high Thermal Flux Density encountered with the Mini LED in COB (Chip on Board) packaging, board-level thermal dissipation is becoming more and more important. This paper analyses characteristics and trends of board-level thermal dissipation of the Mini LED. First, board-level materials are developing from the ordinary PCB (Printed Circuit Board) to metallic materials and ceramic materials. Second, the limitation of process technologies and material costs make thermal dissipation of hybrid substrates the future direction for development. In order to meet the requirements of thermal dissipation for different power devices and products, optimization design and simulation analysis of the thermal dissipation structure becomes a real necessity. Therefore, digitalized thermal simulation design and accurate thermal simulation design become a practical necessity. Finally, the reliability and the interface crack of a large number of micro pores caused by Mini LED board-level thermal dissipation are analyzed. To ensure the massive production of the Mini LED, the process level and the quality control of the entire manufacturing process must be improved.

Citation Download Citation

Wenli Wang and Yu Xiang "Research on board-level thermal dissipation of the mini LED in COB packaging", Proc. SPIE 12781, International Conference on Optoelectronic Information and Functional Materials (OIFM 2023), 127810R (6 August 2023); https://doi.org/10.1117/12.2687165

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