MEMS on PIC: a cross-platform approach to combine ultra-low-power MEMS-modulators with photonic integrated circuit

Martin Blasl; Meysam Namdari; Maximilian Wagner; Jan Grahmann

doi:10.1117/12.3013649

12 March 2024 MEMS on PIC: a cross-platform approach to combine ultra-low-power MEMS-modulators with photonic integrated circuit

Martin Blasl, Meysam Namdari, Maximilian Wagner, Jan Grahmann

Author Affiliations +

Proceedings Volume 12889, Integrated Optics: Devices, Materials, and Technologies XXVIII; 1288917 (2024) https://doi.org/10.1117/12.3013649
Event: SPIE OPTO, 2024, San Francisco, California, United States

Conference Poster

Abstract

The combination of photonic integrated circuits with MEMS allows to change the effective refractive index with unique ultra-low power dissipation characteristics. This enables high integration density applications like photonic quantum computing under cryogenic conditions. The here introduced fabrication technology can universally be applied to all common material platforms, such as silicon, silicon nitride or lithium niobate. The technological flexibility allows to use the IPMS PIC-technology (silicon nitride based) or cooperate very well cross-platforms with partners. The fabrication concept is successfully demonstrated and enables low-voltage devices with very low power consumption and modulation speeds up to megahertz.

Citation Download Citation

Martin Blasl, Meysam Namdari, Maximilian Wagner, and Jan Grahmann "MEMS on PIC: a cross-platform approach to combine ultra-low-power MEMS-modulators with photonic integrated circuit", Proc. SPIE 12889, Integrated Optics: Devices, Materials, and Technologies XXVIII, 1288917 (12 March 2024); https://doi.org/10.1117/12.3013649

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