High-power tests of expanded beam connectors for co-packaged optics applications

Martin Hempstead; Riley S. Freeland; Stephen Q. Smith; Sean B. Treacy; Sharon Lutz; Sherri Dempsey; Arnold Deal; Thomas Mitcheltree; Michael Kadar-Kallen; Erman Timurdogan; Albert Benzoni

doi:10.1117/12.3003234

11 March 2024 High-power tests of expanded beam connectors for co-packaged optics applications

Martin Hempstead, Riley S. Freeland, Stephen Q. Smith, Sean B. Treacy, Sharon Lutz, Sherri Dempsey, Arnold Deal, Thomas Mitcheltree, Michael Kadar-Kallen, Erman Timurdogan, Albert Benzoni

Author Affiliations +

Proceedings Volume 12892, Optical Interconnects XXIV; 128920P (2024) https://doi.org/10.1117/12.3003234
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

Co-Packaged Optics is a development of technology for high speed data switching, to be implemented widely in data center and high-performance computing architectures as a means to continue expansion of bandwidth and reduction of energy per bit. This development removes transceivers from the switch faceplate and replaces them with an optical link from the faceplate to transceiver PICs packaged on or near the ASIC switch substrate. Most approaches involve CW external lasers being carried over polarization-maintaining fiber to the PICs to be modulated for outgoing traffic. Lasers are active components with extremely high power densities and thus a relatively high failure rate, and they perform poorly at high temperatures such as prevail near the switch package. Therefore they will be remotely located or in removeable/front-panel pluggable packages that can be replaced with minimal disruption; this will require the use of optical fiber connectors. System reliability is significantly enhanced by using fewer, higher-power lasers, so very high powers are anticipated for these sources, up to and perhaps exceeding 250 mW, and any connector must be able to reliably tolerate these power levels over the lifetime of the laser or switch box. The use of expanded beam connectors reduces the optical intensity at exposed surfaces compared to PC connectors, and may mitigate some potential issues. We report on our initial studies to address this question of connector performance at these extreme conditions, with results on expanded beam single-mode connectors carrying high laser power in the O-band over many hundreds of hours.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Martin Hempstead, Riley S. Freeland, Stephen Q. Smith, Sean B. Treacy, Sharon Lutz, Sherri Dempsey, Arnold Deal, Thomas Mitcheltree, Michael Kadar-Kallen, Erman Timurdogan, and Albert Benzoni "High-power tests of expanded beam connectors for co-packaged optics applications", Proc. SPIE 12892, Optical Interconnects XXIV, 128920P (11 March 2024); https://doi.org/10.1117/12.3003234

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