Low-loss 800nm-thick PECVD silicon nitride photonic platform on 300-mm wafer

Hong Cai; Bo Li; Yiding Lin; Haitao Yu; Steven Hou Jang Lee; Chin Khang Tew; Jae Ok Yoo; Charmaine Goh; Shervonne Woon; Doris Keh Ting Ng; Navab Singh; Xianshu Luo; Lennon Yao Ting Lee

doi:10.1117/12.3002146

13 March 2024 Low-loss 800nm-thick PECVD silicon nitride photonic platform on 300-mm wafer

Hong Cai, Bo Li, Yiding Lin, Haitao Yu, Steven Hou Jang Lee, Chin Khang Tew, Jae Ok Yoo, Charmaine Goh, Shervonne Woon, Doris Keh Ting Ng, Navab Singh, Xianshu Luo, Lennon Yao Ting Lee

Author Affiliations +

Proceedings Volume 12898, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII; 1289802 (2024) https://doi.org/10.1117/12.3002146
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

In this paper we demonstrate the development and optimization of an 800 nm-thick Plasma-enhanced chemical vapor deposition (PECVD) silicon nitride (SiN) photonic platform on a 300-mm silicon wafer. The implementation of ArF immersion lithography contributes to superior manufacturing processes, as it provides excellent critical dimension (CD) uniformity inter- and intra-wafers, make it an optimal platform of production of integrated circuits and nanoscale devices.

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(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Hong Cai, Bo Li, Yiding Lin, Haitao Yu, Steven Hou Jang Lee, Chin Khang Tew, Jae Ok Yoo, Charmaine Goh, Shervonne Woon, Doris Keh Ting Ng, Navab Singh, Xianshu Luo, and Lennon Yao Ting Lee "Low-loss 800nm-thick PECVD silicon nitride photonic platform on 300-mm wafer", Proc. SPIE 12898, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII, 1289802 (13 March 2024); https://doi.org/10.1117/12.3002146

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