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1 October 1990 Multichip interconnect technique for optoelectronic components
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Abstract
Consideration is given to a multichip interconnect approach representing a new packaging technique that eliminates drawbacks of a conventional hybrid circuit and avoids difficult technologies required for a fully monolithic circuit. The process is considered to be simple, and mass production is considered to be feasible with some automation. Since no constraints are imposed on the chips used, any commercially available device or circuits can be packaged using this technique.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chang Lee Chen, Len J. Mahoney, Dean Z. Tsang, K. M. Molvar, Scott P. Doran, and Vicky Diadiuk "Multichip interconnect technique for optoelectronic components", Proc. SPIE 1291, Optical and Digital Gallium Arsenide Technologies for Signal Processing Applications, (1 October 1990); https://doi.org/10.1117/12.20998
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