Micromanipulators for automatic wafer probing

Ramanamurthy V. Dantu; Nikitas J. Dimopoulos; R. V. Patel; Asim J. Al-Khalili

doi:10.1117/12.21121

1 January 1990 Micromanipulators for automatic wafer probing

Ramanamurthy V. Dantu, Nikitas J. Dimopoulos, R. V. Patel, Asim J. Al-Khalili

Proceedings Volume 1293, Applications of Artificial Intelligence VIII; (1990) https://doi.org/10.1117/12.21121
Event: 1990 Technical Symposium on Optics, Electro-Optics, and Sensors, 1990, Orlando, FL, United States

Abstract

This paper deals with an important problem encountered in automating VLSI wafer probing. In this automation, vision is used for accurately guiding and lowering a probe to make contact with the wafer. The variance of pixel values of the probe and experimental observations are employed for determination of contact beteween the probe and the wafer. Analytical expressions are derived in the paper for the variance of the pixel values of the object with a uniform background and the variation of these values with respect to the distance of the object from the surface is studied. This relationship is experimentally verified for the detection of touch, when the probe is approaching the target pad.

Citation Download Citation

Ramanamurthy V. Dantu, Nikitas J. Dimopoulos, R. V. Patel, and Asim J. Al-Khalili "Micromanipulators for automatic wafer probing", Proc. SPIE 1293, Applications of Artificial Intelligence VIII, (1 January 1990); https://doi.org/10.1117/12.21121

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