Spectral interferometry for TSV metrology in chiplet technology

Stefan Schoeche; Daniel Schmidt; Junwon Han; Shahid Butt; Katherine Sieg; Marjorie Cheng; Aron Cepler; Shaked Dror; Jacob Ofek; Ilya Osherov; Igor Turovets

doi:10.1117/12.3011748

9 April 2024 Spectral interferometry for TSV metrology in chiplet technology

Stefan Schoeche, Daniel Schmidt, Junwon Han, Shahid Butt, Katherine Sieg, Marjorie Cheng, Aron Cepler, Shaked Dror, Jacob Ofek, Ilya Osherov, Igor Turovets

Author Affiliations +

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 129551O (2024) https://doi.org/10.1117/12.3011748
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Comprehensive through-silicon-via (TSV) characterization, including grind side measurements, is critical to ensure device reliability in chiplet technology. Here we report on TSV metrology using spectral interferometry (SI), which is used to acquire absolute phase information of polarized and broad-band light interacting with a sample. This phase information can be translated into the optical path length of the partial beams traveling within the structure. We utilize the spatial separation of peaks related to light reflected from the top surface and the surface of interest to directly measure the TSV depth after reactive ion etching as well as the reveal height on the grind side, without modeling and even in the presence of multilayers or surrounding patterning. Polarization-dependent SI measurements enable the quantification of asymmetry at the bottom of the TSVs not visible in top-down CD measurements. SI is robust and fast and unveils novel information in TSV metrology not accessible with established in-line metrology techniques.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Stefan Schoeche, Daniel Schmidt, Junwon Han, Shahid Butt, Katherine Sieg, Marjorie Cheng, Aron Cepler, Shaked Dror, Jacob Ofek, Ilya Osherov, and Igor Turovets "Spectral interferometry for TSV metrology in chiplet technology", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129551O (9 April 2024); https://doi.org/10.1117/12.3011748

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available