Presentation
10 April 2024 AFM observation of EUV photoresist shrinkage due to electron-beam exposure
Ryosuke Kizu, Kazuhiro Kumagai, Ichiko Misumi, Akiko Hirai, Satoshi Gonda
Author Affiliations +
Abstract
Scanning electron microscopy (SEM) is generally used for line edge roughness (LER) measurement; however, it is difficult to achieve high precision LER measurement of photoresist due to shrinkage caused by electron-beam (EB) exposure. We have developed a metrological tilting-atomic force microscopy (AFM), which has a tip-tilting mechanism to measure vertical sidewall. In the last conference, SPIE-AL-2023, we demonstrated quantitative evaluation of shrinkage of ArF photoresist due to EB exposure by measuring the pattern before and after EB exposure [Kizu et al., Proc. SPIE 12496, 1249605 (2023)]. In this study, we will demonstrate quantitative evaluation of shrinkage of EUV photoresist due to EB exposure by the AFM technology.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryosuke Kizu, Kazuhiro Kumagai, Ichiko Misumi, Akiko Hirai, and Satoshi Gonda "AFM observation of EUV photoresist shrinkage due to electron-beam exposure", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129551U (10 April 2024); https://doi.org/10.1117/12.3010107
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KEYWORDS
Atomic force microscopy

Extreme ultraviolet lithography

Photoresist materials

Shrinkage

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