Innovative wafer defect inspection mode: self-adaptive pattern to pattern inspection

Changlian Yan; Jing Qiao; Yuan Gan; Nuo Ding; Zhao Chen; Ming Ding; Xiaojun Luo; Junhai Jiang; Zongchang Yu; ChunYing Han

doi:10.1117/12.3010013

9 April 2024 Innovative wafer defect inspection mode: self-adaptive pattern to pattern inspection

Changlian Yan, Jing Qiao, Yuan Gan, Nuo Ding, Zhao Chen, Ming Ding, Xiaojun Luo, Junhai Jiang, Zongchang Yu, ChunYing Han

Author Affiliations +

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 129552E (2024) https://doi.org/10.1117/12.3010013
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Conference Poster

Abstract

This study introduces a novel self-adaptive Pattern-to-Pattern (P2P) inspection mode for wafer defect inspection. Different from the traditional Die-to-Die (D2D), Cell-to-Cell (C2C), and Die-to-Database (D2DB) inspection modes, the newly proposed P2P inspection mode has the advantages of no restriction on the inspection region and low dependence on image quality. It works with both SEM images and optical images from different inspection equipment. Using the design layout information, the inspection images are aligned with the design and divided into basic component patterns according to the geometric features of the design pattern. These components are then analyzed through similar pattern comparison to enable the inspection of unique and complex patterns. This self-adaptive method eliminates the influence of the manufacturing process variations by comparing aligned similar image patterns, thereby preventing the reporting of defects highly dependent on the inspection algorithm settings. To facilitate further analysis, a database of the basic pattern components is created by collecting extensive images along with corresponding design layout information.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Changlian Yan, Jing Qiao, Yuan Gan, Nuo Ding, Zhao Chen, Ming Ding, Xiaojun Luo, Junhai Jiang, Zongchang Yu, and ChunYing Han "Innovative wafer defect inspection mode: self-adaptive pattern to pattern inspection", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129552E (9 April 2024); https://doi.org/10.1117/12.3010013

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available