Understanding the stability of advanced inorganic-organic hybrid thin films for advanced resist applications

Dan N. Le; Thi Thu Huong Chu; Jin-Hyun Kim; Jean-Francois Veyan; Won-Il Lee; Nikhil Tiwale; Minjong Lee; Seungsoo Choi; Jihoon Woo; Chang-Yong Nam; Rino Choi; Jiyoung Kim

doi:10.1117/12.3010970

9 April 2024 Understanding the stability of advanced inorganic-organic hybrid thin films for advanced resist applications

Dan N. Le, Thi Thu Huong Chu, Jin-Hyun Kim, Jean-Francois Veyan, Won-Il Lee, Nikhil Tiwale, Minjong Lee, Seungsoo Choi, Jihoon Woo, Chang-Yong Nam, Rino Choi, Jiyoung Kim

Author Affiliations +

Proceedings Volume 12957, Advances in Patterning Materials and Processes XLI; 129570B (2024) https://doi.org/10.1117/12.3010970
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

In this study, we focus on examining the stability of Al-based inorganic-organic hybrid thin films deposited through the molecular atomic layer deposition (MALD) process in ambient environment. Our observations reveal an initial reduction in material thickness within the first 3 days, followed by a period of stability. XPS analysis is employed to further investigate the chemical alternations in the aged Al-based hybrid thin films, revealing an increase in C=O species as well as overall oxygen content in the material. We also evaluate the effects of atmospheric exposure on the sensitivity of the Al-based hybrid thin films using electron flood exposure. This study aims to enhance the understanding of the stability of a vapor-phase synthesized hybrid thin film system for advanced resist applications.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Dan N. Le, Thi Thu Huong Chu, Jin-Hyun Kim, Jean-Francois Veyan, Won-Il Lee, Nikhil Tiwale, Minjong Lee, Seungsoo Choi, Jihoon Woo, Chang-Yong Nam, Rino Choi, and Jiyoung Kim "Understanding the stability of advanced inorganic-organic hybrid thin films for advanced resist applications", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 129570B (9 April 2024); https://doi.org/10.1117/12.3010970

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