Development of thin disk gain medium based on photoadhesion technology

Zuqiang Li; Qi Xiao; Xue Pan; Xinghua Lu; Jiangfeng Wang; Youen Jiang; Wei Fan; Xuechun Li

doi:10.1117/12.3015320

22 December 2023 Development of thin disk gain medium based on photoadhesion technology

Zuqiang Li, Qi Xiao, Xue Pan, Xinghua Lu, Jiangfeng Wang, Youen Jiang, Wei Fan, Xuechun Li

Proceedings Volume 12974, Fifth International Symposium on High Power Laser Science and Engineering (HPLSE 2023); 129740K (2023) https://doi.org/10.1117/12.3015320
Event: Fifth International Symposium on High Power Laser Science and Engineering, 2023, Suzhou, China

Abstract

A comprehensive finite element physics model is constructed to analyze the thermal effects of a thin disk medium. Based on this physical model, the temperature and stress distribution inside the medium are obtained. According to the corresponding theory, the internal optical path difference (OPD) and thermal focal length of the medium can be calculated when subjected to thermal load. According to the numerical model of the thermal effect, which has been verified by experiments conducted on commercial thin disk purchased from Dausinger + Giesen GmbH (DG), the study investigated the influence of various factors on the thermal effect of the thin disk medium. Additionally, a thin disk medium based on photoadhesion technology has been developed. The thermal focal length of the thin disk medium has been compensated by adjusting the surface shape in advance to match the desired focal length, which is significantly higher than that of the uncompensated medium. Below a pump density of 1.27 kW/cm², the thermal focal length of the self-developed thin disk medium is comparable to that of the DG's thin disk medium.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Zuqiang Li, Qi Xiao, Xue Pan, Xinghua Lu, Jiangfeng Wang, Youen Jiang, Wei Fan, and Xuechun Li "Development of thin disk gain medium based on photoadhesion technology", Proc. SPIE 12974, Fifth International Symposium on High Power Laser Science and Engineering (HPLSE 2023), 129740K (22 December 2023); https://doi.org/10.1117/12.3015320

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available