Optical interconnects are of increasing importance for high speed data communications in electronic
or all-optical digital computers [e.g., 1-4]. A problem that has not been solved yet is how to
package optical components in a way that is compatible with the small size of current VLSI sytems.
Conventional optical packaging relies on individual mechanical mounting which results in bulky
large-volume systems. Mechanical packaging is costly and causes problems with the alignment and
the stability of the system. This is especially true, if the alignment tolerances are small, i. e., in the
micron or submicron range.