Analysis of transient thermal inspection

Shek Keung Lau; Darryl P. Almond; Pravinkumar Mulji Patel; J. Corbett; M. B.C. Quigley

doi:10.1117/12.22325

1 October 1990 Analysis of transient thermal inspection

Shek Keung Lau, Darryl P. Almond, Pravinkumar Mulji Patel, J. Corbett, M. B.C. Quigley

Proceedings Volume 1320, Infrared Technology and Applications; (1990) https://doi.org/10.1117/12.22325
Event: Eighth International Conference Infrared Technology and Applications, 1990, London, United Kingdom

Abstract

Pulse-video thermographic images of well characterised sub-surface defects have been examined in detail using an image analyser. The dependence of the transient response on defect size and depth beneath the surface has been established empirically and investigated analytically. Close parallels are drawn with earlier observed thermal wave effects. The work provides an indication of the basic sensitivity of this transient thermal inspection technique.

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Shek Keung Lau, Darryl P. Almond, Pravinkumar Mulji Patel, J. Corbett, and M. B.C. Quigley "Analysis of transient thermal inspection", Proc. SPIE 1320, Infrared Technology and Applications, (1 October 1990); https://doi.org/10.1117/12.22325

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