1 October 1990 Damage-free grinding using ultrafine abrasives
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Proceedings Volume 1320, Infrared Technology and Applications; (1990) https://doi.org/10.1117/12.22337
Event: Eighth International Conference Infrared Technology and Applications, 1990, London, United Kingdom
Both low bonding strength and high density of active grains are iiportant features for carrying out daiage-free grinding. Hoiogeneous ultrafine abrasive pellets were developed by applying electrophoretic deposition. Face grinding of brittle saterials using the pellets enabled creation of a supersiooth surface finish less than lOni peak to valley with no cutting iarks. Moreover, chippingfree grooving was accoiplished using a thin conductive blade on which ultrafine abrasive layer was grown under an electric field.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yasuhiro Tani, Yasuhiro Tani, Jun'ichi Ikeno, Jun'ichi Ikeno, Akihito Fukutani, Akihito Fukutani, } "Damage-free grinding using ultrafine abrasives", Proc. SPIE 1320, Infrared Technology and Applications, (1 October 1990); doi: 10.1117/12.22337; https://doi.org/10.1117/12.22337


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