1 January 1991 Application of real-time holographic interferometry in the nondestructive inspection of electronic parts and assemblies
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Abstract
Nondestructive inspection by holographic interferometry (HI) is quickly gaining acceptance in the electronics industry as a sensitive and accurate method of locating manufacturing and assembly flaws in a wide range of electronics, from individual components to assembled modules. This paper describes the specific application of real-time HI in the nondestructive analysis of circuit board heat exchangers and multiple-layer printed wiring boards to locate areas of debonding and delamination. In the application of HI, the choice of a stressing method is often as important as the choice of a specific HI technique. Methods for component stressing include thermal, vibrational, and pressure-induced stressing methods, and these are described in detail. In addition, two techniques for sensitivity enhancement, phase shift interferometry and beam tilt correction, are discussed in detail.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Craig P. Wood, Craig P. Wood, James D. Trolinger, James D. Trolinger, } "Application of real-time holographic interferometry in the nondestructive inspection of electronic parts and assemblies", Proc. SPIE 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection, (1 January 1991); doi: 10.1117/12.51064; https://doi.org/10.1117/12.51064
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