1 November 1990 Automatic inspection of solder joints on printed circuit board
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Abstract
The quality of solder joints on printed circuit board (PCB) is directly related to the reliablity and stablity of electronic products. How to ensure the quality of solder joints? One necessary step in production is the inspection of defective solder joints. In this paper, an automatic holographic interferential inspection method on PCB solder joints is presented. Based on this method, the inspection system ,which includes three parts -- Optic imaging system(OIS), Automatic control system(ACS) and Processing and recognition system(PRS), has also been discussed. A series of interferential fringe image processing algorithms are put forward and discussed at the end of the paper.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
De-Chen Zhan, Jing-Chun Chen, Zhong-Rong Li, "Automatic inspection of solder joints on printed circuit board", Proc. SPIE 1338, Optoelectronic Devices and Applications, (1 November 1990); doi: 10.1117/12.22991; https://doi.org/10.1117/12.22991
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